Industry Solutions

Semiconductor equipment

High reliability and stability, deeply trusted by customers.

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Industry Solutions

Semiconductor equipment — What We Produce

High reliability and stability, deeply trusted by customers.

Semiconductor equipment parts live or die on flatness, surface finish and leak tightness. We machine vacuum-facing surfaces on 5-axis centers and measure them on a CMM before the part is cleaned and packed.

Manifolds and chamber components can be helium leak tested and delivered in cleanroom-compatible packaging when your process requires it.

Typical parts

Part	Recommended alloy	Industry
Precision plates	6061-T6 / A356	Semiconductor equipment
Vacuum chamber parts	6061-T6 / A356	Semiconductor equipment
Manifolds	6061-T6 / A356	Semiconductor equipment
Base plates	6061-T6 / A356	Semiconductor equipment

Quality documents for this sector

Material certificate with full chemistry and heat-number traceability
CMM report on flatness, parallelism and Ra of vacuum faces
Helium leak test on vacuum chamber parts and manifolds
Cleanroom packing and particle-cleanliness record where required
Ultrasonic or dye-penetrant inspection on critical walls

Process route

RFQ & DFMWall thickness, draft, cores and tolerances reviewed; process recommended.
CastingGravity, low-pressure or sand selected per part geometry and volume.
Heat treatmentT6 where structural strength or pressure tightness is required.
CNC machining3-, 4- or 5-axis finishing to ±0.05 mm on critical features.
Surface treatmentShot blasting, anodizing, powder coating or painting to the sector's spec.
Inspection & packingCMM, X-ray and pressure test as required; export packing with documents.

Have a part for this industry?

Send the drawing or a sample photo — you will get a process recommendation, alloy advice and a written quote within 24 hours.

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